{"id":11950,"date":"2019-03-20T14:40:29","date_gmt":"2019-03-20T13:40:29","guid":{"rendered":"https:\/\/www.mancinienterprise.com\/SEMICON\/?page_id=5"},"modified":"2024-03-18T19:00:50","modified_gmt":"2024-03-18T18:00:50","slug":"homepage","status":"publish","type":"page","link":"https:\/\/www.mancinienterprise.com\/SEMICON\/","title":{"rendered":"Homepage"},"content":{"rendered":"

<\/div>
<\/div><\/div><\/div><\/div><\/div>

Everything you need for your Semiconductors Production Line<\/h1>\n<\/div>

A complete set of solutions for semiconductors production. <\/span><\/span><\/h4>\n<\/div>

Mancini Enterprise is able to develop best projects to satisfy any requirement for semiconductors manufacturing lines.<\/p>\n

<\/div>\n
<\/div>\n
<\/div>\n<\/div>
<\/div><\/div><\/div>
<\/span><\/div><\/div>
<\/div><\/div><\/div><\/div><\/div>
<\/div><\/div><\/div>

We distribute best brands<\/h1>\n<\/div>

Our Partners developed most advanced technologies in the SMT field and have a more of 30 years experience in supply our Clients with specific products for the microchip manufacturing.<\/p>\n<\/div>

<\/div><\/div><\/div>
<\/div><\/div><\/div>
<\/i><\/div>

Reliability<\/h2><\/div>
<\/div>
\n

We are collaborating in various fields with our supplier partners from more than 30 years.<\/p>\n<\/div><\/div><\/div>

<\/i><\/div>

Best Brands<\/h2><\/div>
<\/div>
\n

Our Partners are Brands with a solid reputation in their sector obtained with a continuous upgrade of their solutions to the top standards of the market.<\/p>\n<\/div><\/div><\/div>

<\/i><\/div>

Technology<\/h2><\/div>
<\/div>
\n

Our competence is the warranty that the systems we develop for our Clients are at highest levels of R & D and Technology available today on the market .<\/p>\n<\/div><\/div><\/div>

<\/div><\/div>
<\/div><\/div><\/div><\/div><\/div>
<\/div>
<\/div><\/div><\/div><\/div><\/div>

Reflow Ovens<\/span><\/h2>\n<\/div>
<\/a><\/span><\/div><\/div>

Heller Industries offers multiple solutions for semiconductor advanced packaging applications such as bumping, die attach, underfill curing, lid attach and ball attach. Heller offers multiple cleanroom class options and a range of automation options for wafers, wafers on frame, glass panels, and other substrates.<\/p>\n

\n<\/div>

<\/div><\/div><\/div>

AOI Systems <\/span><\/h2>\n<\/div>
<\/a><\/span><\/div><\/div>

Parmi AOI Systems <\/b><\/span><\/span>perform <\/b><\/span>extremely fast laser scanning with <\/strong>fastest inspection speed. They support a <\/strong>precise 2D\/3D Image , a <\/strong>high quality 3D image and the <\/strong>Inspection is accurate regardless of surface roughness and shape. With a <\/strong>convenient teaching and debugging <\/strong>wizard based programming and an <\/strong>Intuitive UI, the setup is very easy.<\/strong><\/p>\n<\/div>

<\/div><\/div><\/div>

Loaders and Unload solutions<\/h2>\n<\/div>
<\/a><\/span><\/div><\/div>

 <\/p>\n

With Nutek Team performance you will continue to move forward and you can be sure that you are ready for your future.<\/p>\n<\/div>

<\/div><\/div><\/div>

Flip Chip Bonder & Hybrid Placer<\/h2>\n<\/div>
<\/a><\/span><\/div><\/div>

High bonding accuracy and x3 productivity of conventional machines<\/p>\n<\/div>

<\/div><\/div><\/div>

Marking Solutions<\/h2>\n<\/div>
<\/a><\/span><\/div><\/div>

Marking Systems by KEYENCE Co2 Laser Technology<\/p>\n<\/div>

<\/div><\/div><\/div><\/div><\/div>
<\/div><\/div><\/div>

Heller Products: <\/span><\/h1>\n<\/div>

A complete range of reflow ovens for <\/span>Semiconductors Production<\/span><\/span><\/p>\n<\/div><\/div><\/div>

<\/div><\/div><\/div><\/div><\/div>
<\/div>
<\/div><\/div><\/div><\/div><\/div>
<\/span><\/div><\/div>
<\/div><\/div><\/div>

Heller<\/span>: Semiconductor Advanced Packaging<\/h1>\n<\/div>
<\/div>

Heller Industries offers multiple solutions for semiconductor advanced packaging applications such as bumping, die attach, underfill curing, lid attach and ball attach.<\/p>\n<\/div>

<\/div><\/div><\/div>
<\/div>
<\/div>
<\/div>
<\/div><\/div><\/div>
<\/i><\/span><\/div>

Ball Attach<\/h2><\/div>
<\/div>
\n

A typical ball attach process for requires a stable reflow process compatible with a clean room environment. Heller\u2019s horizontal reflow ovens satisfy both of these.<\/p>\n

More info..<\/a><\/p>\n<\/div><\/div><\/div>

<\/i><\/span><\/div>

Bumping and Die Attach<\/h2><\/div>
<\/div>
\n

Bumping and die attach (also known as flip chip die attach) are essential steps to wafer-level or board-level semiconductor advanced packaging which require separate reflow processes.<\/p>\n

More info …<\/a><\/p>\n<\/div><\/div><\/div>

<\/i><\/span><\/div>

Underfill Curing<\/h2><\/div>
<\/div>
\n

Heller offers several types of curing ovens suitable for both device-level and board-level underfill curing. Heller curing ovens have cleanroom and full automation options and are suitable for high volume manufacturing.<\/p>\n

More info ..<\/a>.<\/p>\n<\/div><\/div><\/div>

<\/i><\/span><\/div>

TIM\/Lid Attach<\/h2><\/div>
<\/div>
\n

Semiconductor lid attach with thermal interface materials require a void free connection to ensure optimal heat dissipation ability. Heller offers 3 solutions of this application: pressure curing ovens (PCO), pressure reflow ovens (PRO), and formic reflow ovens.<\/p>\n

More info …<\/a><\/p>\n<\/div><\/div><\/div>

<\/i><\/span><\/div>

Glass Substrates<\/h2><\/div>
<\/div>
\n

Heller has experience with handling glass substrates, including glass wafers and panels (up to 600mm). Large panel handling can be incorporated into both horizontal and vertical format ovens.<\/p>\n<\/div><\/div><\/div>

<\/div><\/div>
<\/div><\/div><\/div>
Go to HELLER website products page<\/span><\/a><\/div>
<\/div><\/div><\/div><\/div><\/div>
<\/div><\/div><\/div>

Parmi Products: <\/span><\/h1>\n<\/div>

AOI solutions for semiconductor production<\/span><\/p>\n<\/div><\/div><\/div>

<\/div><\/div><\/div><\/div><\/div>
<\/div>
<\/div><\/div><\/div><\/div><\/div>
<\/span><\/div><\/div>
<\/div><\/div><\/div>

Parmi<\/span>: AOI Systems<\/h1>\n<\/div>
<\/div>

Parmi offers inspection solutions for semiconductor \u00a0such:
\nSiP, Tiny chips (0201~ : metric), Semiconductor materials (e.g. Die, Lead Frame, Bump, IGBT, etc.), and other components inspection
\nWire bonding inspection (e.g. Ball, Foot, Tail, Loop, etc.)<\/p>\n<\/div>

<\/div><\/div><\/div>
<\/div>
<\/div>
<\/div>
<\/div><\/div><\/div>
<\/i><\/span><\/div>

XCEED MICRO<\/h2><\/div>
<\/div>
\n

Ultra-Precision 3D AOI for Semiconductor Packaging<\/p>\n

Extremely Fast and High-Resolution Laser Line Scan Method<\/p>\n

Perfect Inspection even for Highly Specular Surfaces<\/p>\n

Inspection Irrelevant to Color, Material, Surface Roughness<\/p>\n

Inspection Items:<\/p>\n

SiP, Die Attach, Underfill, Solder paste and Bump, Cu Clip on Die, IGBT, etc.<\/i><\/p>\n

More info..<\/a><\/span><\/span><\/p>\n<\/div><\/div><\/div>

<\/i><\/span><\/div>

AXION<\/h2><\/div>
<\/div>
\n

Ultra-Precision 2D&3D AOI for Semiconductor Packaging<\/p>\n

Magazine Loader\/Unloader Built-in Type<\/p>\n

Extremely Fast and High-ResolutionResolution Laser Line Scan Method<\/p>\n

Inspection Irrelevant to Color, Material, Surface Roughness<\/p>\n

Perfect Inspection even for Highly Specular Surfaces<\/p>\n

Inspection Items:<\/p>\n

SiP, Die Attach, Underfill, Solder paste and Bump, Cu Clip on Die, IGBT, etc.<\/i><\/span><\/p>\n

More info..<\/a><\/span><\/span><\/p>\n<\/div><\/div><\/div>

<\/i><\/span><\/div>

PRECION<\/h2><\/div>
<\/div>
\n

Ultra-Precision 2D&3D AOI for Wirebonding<\/p>\n

Magazine Loader\/Unloader Built-in Type<\/p>\n

Extremely Fast and High-Resolution Inspection Capability<\/p>\n

Inspection of a Minimum Diameter of \u00d8 0.6 mil Wire (Cu, Au, Al)<\/p>\n

Inspection Items:<\/p>\n

Wire, Ball, Stitch, Die, Lead Frame, etc.<\/i><\/span><\/p>\n

More info..<\/a><\/span><\/span><\/p>\n<\/div><\/div><\/div>

<\/i><\/span><\/div>

ARTION<\/h2><\/div>
<\/div>
\n

Ultra-Precision 2D&3D AOI for Wafer Inspection<\/p>\n

High-Resolution Color Image<\/span><\/p>\n

Easy Teaching, Inspection Result Management<\/p>\n

Interworking with EFEM<\/p>\n

High Precision\u2028Granite X\/Y\/Z stage<\/p>\n

8\u201d, 12\u201d Ringframe Wafer\u2028: Multi Load Port & Dual arm<\/p>\n

Stable\u2028Porous Vacuum Chuck<\/p>\n

Inspection Items:<\/p>\n

Wafer Die(Chipping, Contamination, etc.), Bump(Height, Offset, Coplanarity, etc.)<\/i><\/span><\/p>\n

More info..<\/a><\/span><\/span><\/p>\n<\/div><\/div><\/div>

<\/div><\/div>
<\/div><\/div><\/div>
Go to PARMI website products page<\/span><\/a><\/div>
<\/div><\/div><\/div><\/div><\/div>
<\/div><\/div><\/div>

Nutek Products: <\/span><\/h1>\n<\/div>

Loaders and Unload solutions<\/span><\/p>\n<\/div><\/div><\/div>

<\/div><\/div><\/div><\/div><\/div>
<\/div>
<\/div><\/div><\/div><\/div><\/div>
<\/span><\/div><\/div>
<\/div><\/div><\/div>

Nutek<\/span>:Loaders and Unload solutions<\/h1>\n<\/div>
<\/div>

PERFECTLY FINE-TUNE YOUR PCB CIRCUITS-<\/i><\/p>\n

With Nutek Team performance you will continue to move forward and you can be sure that you are ready for your future.<\/p>\n<\/div>

<\/div><\/div><\/div>
<\/div>
<\/div>
<\/div>
<\/div><\/div><\/div>
<\/i><\/span><\/div>

ADVANCE PLATFORM LINE LOADER\/ UNLOADER<\/h2><\/div>
<\/div>
\n

Used to either load or unload substrates, leadframes and carriers. System uses a pneumatic pusher and integrated conveyor for loading or unloading of the line.<\/span><\/p>\n

More info..<\/a><\/span><\/span><\/p>\n<\/div><\/div><\/div>

<\/i><\/span><\/div>

HIGH SPEED MINI LOADER <\/h2><\/div>
<\/div>
\n

The high speed mini loader is used to load substrates, lead-frames, SERIES carriers onto the line. The full magazine is automatically picked up from the lower magazine conveyor. When in position a pneumatic pusher is used to push the product out of the magazine starting at the bottom magazine slot. When the magazine is empty it is placed on the upper magazine conveyor.<\/span><\/p>\n

More info..<\/a><\/span><\/span><\/p>\n<\/div><\/div><\/div>

<\/i><\/span><\/div>

HIGH SPEED MINI UNLOADER<\/h2><\/div>
<\/div>
\n

The high speed mini unloader is used to unload substrates, SERIES lead- frames, carriers from the line. The empty magazine is automatically picked up from the upper magazine conveyor. Via the mini conveyor the product is transferred into the magazine, starting at the top magazine slot. A pneumatic pusher extends to push the product completely inside the magazine before magazine indexes to the next position. When the magazine is full it is transferred on to the lower magazine conveyor.<\/span><\/p>\n

More info..<\/a><\/span><\/span><\/p>\n<\/div><\/div><\/div>

<\/i><\/span><\/div>

JEDEC TRAY LOADER<\/h2><\/div>
<\/div>
\n

The JEDEC Tray Loader is used for loading JEDEC trays onto the production line.<\/p>\n

More info..<\/a><\/span><\/span><\/p>\n<\/div><\/div><\/div>

<\/i><\/span><\/div>

JEDEC TRAY UNLOADER<\/h2><\/div>
<\/div>
\n

The JEDEC Tray Unloader is used for unloading JEDEC trays from the production line.<\/p>\n

More info..<\/a><\/span><\/span><\/p>\n<\/div><\/div><\/div>

<\/i><\/span><\/div>

PLATFORM LINE LOADER\/UNLOADER<\/h2><\/div>
<\/div>
\n

Used to either load or unload substrates, leadframes and carriers. SERIES System uses a pneumatic pusher and integrated conveyor for loading or unloading of the line.<\/p>\n

More info..<\/a><\/span><\/span><\/p>\n<\/div><\/div><\/div>

<\/div><\/div>
<\/div><\/div><\/div>
Go to NUTEK website products page<\/span><\/a><\/div>
<\/div><\/div><\/div><\/div><\/div>

Yamaha Products: <\/span><\/h1>\n<\/div>

Hybrid Placer & <\/span><\/span>Flip Chip Bonder <\/span><\/p>\n<\/div><\/div><\/div>

<\/div><\/div><\/div><\/div><\/div>
<\/div>
<\/div><\/div><\/div><\/div><\/div>
<\/span><\/div><\/div>
<\/div><\/div><\/div>

Yamaha<\/span>: Hybrid Placer & Flip Chip Bonder<\/h1>\n<\/div>
<\/div>

Yamaha innovative products for Semiconductors Manufacturing ….<\/p>\n<\/div>

<\/div><\/div><\/div>
<\/div>
<\/div>
<\/div>
<\/div><\/div><\/div>
<\/span><\/div><\/div><\/div>
<\/div><\/div><\/div>
<\/i><\/span><\/div>

HYBRID PLACER I-CUBE10 <\/h2><\/div>
<\/div>
\n

Yamaha proprietary hybrid placer, best suitable for module device, that consists of semiconductor and SMD.<\/p>\n

More info..<\/a><\/span><\/span><\/p>\n<\/div><\/div><\/div>

<\/div><\/div>
<\/div><\/div><\/div>
Go to YAMAHA website products page<\/span><\/a><\/div>
<\/div><\/div><\/div><\/div><\/div>

Kubomark Products: <\/span><\/h1>\n<\/div>

Marking Solutions based on KEYENCE Co2 Laser technology<\/span><\/span><\/p>\n<\/div><\/div><\/div>

<\/div><\/div><\/div><\/div><\/div>
<\/div>
<\/div><\/div><\/div><\/div><\/div><\/div>
<\/span><\/div><\/div>
<\/div><\/div><\/div>

KUBOMARK:<\/span><\/span> Marking Systems ..<\/h1>\n<\/div>
<\/div>

A line of marking solutions for any customer requirement.<\/p>\n<\/div>

<\/div><\/div><\/div>
<\/div>
<\/div>
<\/div>
<\/div><\/div><\/div>
<\/span><\/div><\/div><\/div>
<\/div><\/div><\/div>
<\/i><\/span><\/div>

DESKMARK <\/h2><\/div>
<\/div>
\n

A compact desktop solutions, 3D marking system on metals by Keyence MDX head type.<\/p>\n

More info..<\/span><\/span><\/a><\/p>\n<\/div><\/div><\/div>

<\/div><\/div>
<\/div><\/div><\/div>
Go to KUBOMARK website products page<\/span><\/a><\/div>
<\/div><\/div><\/div><\/div><\/div>
<\/div>
<\/span><\/div><\/div><\/div><\/div>
<\/div><\/div><\/div>
<\/span><\/div><\/div><\/div><\/div>
<\/div><\/div><\/div>
<\/span><\/div><\/div><\/div><\/div>
<\/div><\/div><\/div>

We Have a Solution for Any Requirement…<\/h1>\n<\/div>

Ask to Us …<\/p>\n<\/div>

<\/div>
<\/div>
<\/div>
Contact Mancini Enterprise<\/span><\/a><\/div><\/div><\/div>
<\/div><\/div><\/div><\/div><\/div>

Upgrade your production line.<\/span><\/h2>\n

.\"\"<\/span><\/h2>\n<\/div>
<\/div><\/div><\/div><\/div><\/div>
<\/div>
<\/div><\/div><\/div><\/div><\/div>

Develop Your Semiconductors<\/span> Production line with us..<\/span><\/h1>\n<\/div>

Order it by Mancini Enterprise or TTS Spain<\/span><\/p>\n<\/div>

<\/div><\/div><\/div>
Order now!<\/span><\/a><\/div><\/div><\/div>
<\/div><\/div><\/div><\/div><\/div><\/p>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":4,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"100-width.php","meta":{"footnotes":""},"_links":{"self":[{"href":"https:\/\/www.mancinienterprise.com\/SEMICON\/index.php?rest_route=\/wp\/v2\/pages\/11950"}],"collection":[{"href":"https:\/\/www.mancinienterprise.com\/SEMICON\/index.php?rest_route=\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.mancinienterprise.com\/SEMICON\/index.php?rest_route=\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.mancinienterprise.com\/SEMICON\/index.php?rest_route=\/wp\/v2\/users\/4"}],"replies":[{"embeddable":true,"href":"https:\/\/www.mancinienterprise.com\/SEMICON\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=11950"}],"version-history":[{"count":219,"href":"https:\/\/www.mancinienterprise.com\/SEMICON\/index.php?rest_route=\/wp\/v2\/pages\/11950\/revisions"}],"predecessor-version":[{"id":12390,"href":"https:\/\/www.mancinienterprise.com\/SEMICON\/index.php?rest_route=\/wp\/v2\/pages\/11950\/revisions\/12390"}],"wp:attachment":[{"href":"https:\/\/www.mancinienterprise.com\/SEMICON\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=11950"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}