Everything you need for your Semiconductors Production Line

A complete set of solutions for semiconductors production.

Mancini Enterprise is able to develop best projects to satisfy any requirement for semiconductors manufacturing lines.

We distribute best brands

Our Partners developed most advanced technologies in the SMT field and have a more of 30 years experience in supply our Clients with specific products for the microchip manufacturing.

Reliability

We are collaborating in various fields with our supplier partners from more than 30 years.

Best Brands

Our Partners are Brands with a solid reputation in their sector obtained with a continuous upgrade of their solutions to the top standards of the market.

Technology

Our competence is the warranty that the systems we develop for our Clients are at highest levels of R & D and Technology available today on the market .

Reflow Ovens

Heller Industries offers multiple solutions for semiconductor advanced packaging applications such as bumping, die attach, underfill curing, lid attach and ball attach. Heller offers multiple cleanroom class options and a range of automation options for wafers, wafers on frame, glass panels, and other substrates.

AOI Systems

Parmi AOI Systems perform extremely fast laser scanning with fastest inspection speed. They support a precise 2D/3D Image , a high quality 3D image and the Inspection is accurate regardless of surface roughness and shape. With a convenient teaching and debugging wizard based programming and an Intuitive UI, the setup is very easy.

Loaders and Unload solutions

With Nutek Team performance you will continue to move forward and you can be sure that you are ready for your future.

Flip Chip Bonder & Hybrid Placer

High bonding accuracy and x3 productivity of conventional machines

Marking Solutions

Marking Systems by KEYENCE Co2 Laser Technology

Heller Products:

A complete range of reflow ovens for Semiconductors Production

Heller: Semiconductor Advanced Packaging

Heller Industries offers multiple solutions for semiconductor advanced packaging applications such as bumping, die attach, underfill curing, lid attach and ball attach.

Ball Attach

A typical ball attach process for requires a stable reflow process compatible with a clean room environment. Heller’s horizontal reflow ovens satisfy both of these.

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Bumping and Die Attach

Bumping and die attach (also known as flip chip die attach) are essential steps to wafer-level or board-level semiconductor advanced packaging which require separate reflow processes.

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Underfill Curing

Heller offers several types of curing ovens suitable for both device-level and board-level underfill curing. Heller curing ovens have cleanroom and full automation options and are suitable for high volume manufacturing.

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TIM/Lid Attach

Semiconductor lid attach with thermal interface materials require a void free connection to ensure optimal heat dissipation ability. Heller offers 3 solutions of this application: pressure curing ovens (PCO), pressure reflow ovens (PRO), and formic reflow ovens.

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Glass Substrates

Heller has experience with handling glass substrates, including glass wafers and panels (up to 600mm). Large panel handling can be incorporated into both horizontal and vertical format ovens.

Go to HELLER website products page

Parmi Products:

AOI solutions for semiconductor production

Parmi: AOI Systems

Parmi offers inspection solutions for semiconductor such:
SiP, Tiny chips (0201~ : metric), Semiconductor materials (e.g. Die, Lead Frame, Bump, IGBT, etc.), and other components inspection
Wire bonding inspection (e.g. Ball, Foot, Tail, Loop, etc.)

XCEED MICRO

Ultra-Precision 3D AOI for Semiconductor Packaging

Extremely Fast and High-Resolution Laser Line Scan Method

Perfect Inspection even for Highly Specular Surfaces

Inspection Irrelevant to Color, Material, Surface Roughness

Inspection Items:

SiP, Die Attach, Underfill, Solder paste and Bump, Cu Clip on Die, IGBT, etc.

More info..

AXION

Ultra-Precision 2D&3D AOI for Semiconductor Packaging

Magazine Loader/Unloader Built-in Type

Extremely Fast and High-ResolutionResolution Laser Line Scan Method

Inspection Irrelevant to Color, Material, Surface Roughness

Perfect Inspection even for Highly Specular Surfaces

Inspection Items:

SiP, Die Attach, Underfill, Solder paste and Bump, Cu Clip on Die, IGBT, etc.

More info..

PRECION

Ultra-Precision 2D&3D AOI for Wirebonding

Magazine Loader/Unloader Built-in Type

Extremely Fast and High-Resolution Inspection Capability

Inspection of a Minimum Diameter of Ø 0.6 mil Wire (Cu, Au, Al)

Inspection Items:

Wire, Ball, Stitch, Die, Lead Frame, etc.

More info..

ARTION

Ultra-Precision 2D&3D AOI for Wafer Inspection

High-Resolution Color Image

Easy Teaching, Inspection Result Management

Interworking with EFEM

High Precision Granite X/Y/Z stage

8”, 12” Ringframe Wafer : Multi Load Port & Dual arm

Stable Porous Vacuum Chuck

Inspection Items:

Wafer Die(Chipping, Contamination, etc.), Bump(Height, Offset, Coplanarity, etc.)

More info..

Go to PARMI website products page

Nutek Products:

Loaders and Unload solutions

Nutek:Loaders and Unload solutions

PERFECTLY FINE-TUNE YOUR PCB CIRCUITS-

With Nutek Team performance you will continue to move forward and you can be sure that you are ready for your future.

ADVANCE PLATFORM LINE LOADER/ UNLOADER

Used to either load or unload substrates, leadframes and carriers. System uses a pneumatic pusher and integrated conveyor for loading or unloading of the line.

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HIGH SPEED MINI LOADER

The high speed mini loader is used to load substrates, lead-frames, SERIES carriers onto the line. The full magazine is automatically picked up from the lower magazine conveyor. When in position a pneumatic pusher is used to push the product out of the magazine starting at the bottom magazine slot. When the magazine is empty it is placed on the upper magazine conveyor.

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HIGH SPEED MINI UNLOADER

The high speed mini unloader is used to unload substrates, SERIES lead- frames, carriers from the line. The empty magazine is automatically picked up from the upper magazine conveyor. Via the mini conveyor the product is transferred into the magazine, starting at the top magazine slot. A pneumatic pusher extends to push the product completely inside the magazine before magazine indexes to the next position. When the magazine is full it is transferred on to the lower magazine conveyor.

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JEDEC TRAY LOADER

The JEDEC Tray Loader is used for loading JEDEC trays onto the production line.

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JEDEC TRAY UNLOADER

The JEDEC Tray Unloader is used for unloading JEDEC trays from the production line.

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PLATFORM LINE LOADER/UNLOADER

Used to either load or unload substrates, leadframes and carriers. SERIES System uses a pneumatic pusher and integrated conveyor for loading or unloading of the line.

More info..

Go to NUTEK website products page